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See how PolyStrata® mmWave packages can revolutionize your designs. Booth 510
Discover the future of high-frequency packaging with Nuvotronics at the Device Packaging Show. Explore our revolutionary PolyStrata® solutions for compact, high-performance packages designed for lowest loss, ultra-wideband performance and reliability in demanding RF and microwave applications.
Nuvotronics is excited to introduce our new low loss cutting-edge air-cavity package optimized specifically for 2-20 GHz, 10 Watt PA. Designed for ease of integration, this package provides SMT compatibility while maintaining the high performance of the TGA2962 die.
- The PSP1029439 outperforms comparable packages by offering superior thermal management.
- Efficient heat removal from the die via the top and sides of the package—eliminates the need for a thermal path through the PCB while enhancing heat dissipation.
- With compact dimensions of 5.5 x 6 x 1.45mm, it includes a matched metal lid and space to incorporate 820 pF wire-bonded capacitors for added stability.
Ideal for military, space, communications and instrumentation applications, this advanced package meets the demands of high-performance environments, ensuring reliability and efficiency for your critical systems.
PolyStrata Package’s Measured Success Against Ceramic Alternatives
Nuvotronics recently performed a comparison focusing on the performance of PolyStrata RF packaging technology versus traditional ceramic alternatives. The results demonstrate that PolyStrata RF packaging outperforms ceramic alternatives, making it a promising and cost-effective solution for next-generation RF applications.
Lower Insertion Loss Packages: Streamlining Surface Mount LNAs for Faster, Cost-Effective Integration
Our surface mount package for the Northrop Grumman ALP302 17-21 GHz low-noise amplifier (LNA) can replace the entire chain of LNA transistors typically used in a Ka-Band receive ground terminal front-end. Leverage our streamlined design and integration process to reduce development time and costs.
Unlock the possibilities of mmWave applications:
- Ultra-compact
- Lowest-loss
- Ultra-wideband performance reliability
- COTS mmWave packages
New state of the art low loss MMIC package
- Superior performance
- Smaller size
- Surface mountable with standard SMT processes
