
Unlock the possibilities of mmWave applications with ultra-compact, low-loss mmWave packages
Imagine building high-frequency millimeter-wave systems using the same surface mount technology (SMT) as common electronic components, without compromising performance.
This offers several advantages, including:
- Increased first-time success rates: SMT simplifies assembly and reduces the potential for errors compared to traditional methods like wire bonding.
- Faster innovation cycles: Easier component integration allows for quicker design changes and prototyping.
- Reduced rework costs: Lower assembly complexity minimizes the need for rework and troubleshooting.
- Wideband performance: These packages maintain minimal signal loss (low parasitic characteristics) up to 95 GHz, making them suitable for a wide range of mmWave applications.
Case Study:
The Nuvotronics PSP1025530_002 delivers game-changing size reductions
Our surface mount package for the Northrop Grumman ALP302 17-21 GHz low-noise amplifier (LNA) can replace the entire chain of LNA transistors typically used in a Ka-band receive ground terminal front-end.

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